Magnetic semiconductor testing is becoming an increasingly important part of the manufacturing flow as semiconductor devices and advanced packaging architectures become more complex. A new feature in Advanced Packaging Magazine highlights how Hprobe, a Mycronic company, contributes to this challenge with automated magnetic test equipment for MRAM and magnetic sensors.
The feature, “Shaping the next decade of advanced packaging innovation,” brings together several Mycronic companies and examines the technologies supporting critical stages of semiconductor and electronics manufacturing. The article covers testing, surface preparation, die bonding and photonic integration, with a common focus on improving yield, precision, throughput and process stability. Read the full feature in Advanced Packaging Magazine
Why magnetic semiconductor testing matters in advanced packaging
Advanced packaging is enabling increasingly complex semiconductor architectures, including chiplets, heterogeneous integration, 2.5D and 3D packaging, as well as silicon photonics and co-packaged optics.
As the manufacturing flow becomes more complex, identifying device-level issues before expensive packaging operations take place becomes increasingly important. This is particularly relevant for magnetic devices such as Magnetoresistive Random-Access Memory (MRAM) and magnetic sensors.
Unlike conventional semiconductor devices, these components need to be characterized not only through electrical measurements but also under controlled magnetic field conditions. Their performance can depend on both the amplitude and orientation of the applied magnetic field.
This makes magnetic semiconductor testing an important step in determining whether devices meet the required performance and process specifications before they move further into the manufacturing flow.
Hprobe brings controlled magnetic testing to wafer level
As highlighted in the Advanced Packaging Magazine feature, Hprobe develops automated magnetic test equipment dedicated to magnetic semiconductor devices.
Its patented three-dimensional magnetic field technology enables vectorial magnetic field generation in different directions, allowing magnetic devices to be characterized under controlled and repeatable conditions.
The technology described in the feature supports magnetic fields above 200 mT in any direction, with field levels exceeding 500 mT in-plane and 250 mT out-of-plane across a large, highly uniform test area. Magnetic field sweep rates can reach up to 2 T/s.
Hprobe’s platforms can be integrated with industry-standard wafer probers and automated test equipment, supporting both development and high-volume manufacturing on 200 mm and 300 mm wafers. Explore Hprobe’s magnetic test equipment and platforms
This combination of magnetic field generation, electrical testing and wafer-level automation allows manufacturers to characterize magnetic devices earlier in the production process.
From MRAM testing to magnetic sensor characterization
MRAM is one of the key applications for Hprobe’s magnetic test technology. Magnetic field sweeps can be combined with electrical measurements to characterize device behavior, switching performance and other magnetic properties.
Hprobe provides dedicated solutions for MRAM characterization from R&D through production, including testing of different MRAM technologies and device architectures. Discover Hprobe’s MRAM test solutions
The same principle applies to magnetic sensors. Hall, AMR, GMR and TMR sensors depend on their response to magnetic fields, making controlled magnetic stimulation an essential part of their characterization and production testing.
Hprobe’s automated magnetic testing solutions are designed to provide precise and repeatable magnetic conditions while integrating with semiconductor test environments.
Testing before and after advanced packaging
One of the key points highlighted in the Advanced Packaging Magazine article is the importance of testing at different stages of the manufacturing process.
At wafer level, magnetic testing can help identify process variations, monitor production quality and screen devices before they enter more costly packaging operations. This can help reduce manufacturing risk while supporting process development and yield optimization.
Testing does not necessarily stop once a device has been packaged. Magnetic devices can also require validation under controlled magnetic field conditions after packaging.
Hprobe’s packaged-device testing approach combines three-dimensional magnetic field control with automated calibration and field mapping at the device-under-test position. This enables repeatable measurements while accounting for the magnetic characteristics that need to be evaluated after packaging.
A broader Mycronic approach to advanced packaging
The Advanced Packaging Magazine feature places Hprobe within a broader Mycronic portfolio addressing different stages of the advanced packaging manufacturing flow.
Surfx Technologies focuses on surface preparation using atmospheric plasma technology. MRSI provides precision die bonding technologies for optoelectronic and microelectronic packaging. Vanguard Automation addresses photonic integration through 3D nano-printing and photonic wire bonding.
Hprobe contributes a different but complementary capability: controlled magnetic semiconductor testing.
Together, these technologies illustrate an important aspect of advanced packaging. The challenge is not only to develop individual technologies, but to integrate multiple manufacturing steps into a stable, repeatable and high-yield production flow.
For magnetic devices, that flow starts with reliable characterization and testing to ensure that only devices meeting the required specifications move forward.
Magnetic testing as part of the manufacturing flow
As advanced packaging continues to evolve, testing becomes increasingly connected to the overall manufacturing strategy.
For MRAM and magnetic sensors, electrical measurements alone do not provide the complete picture. Controlled magnetic field generation is required to understand how devices behave under different field amplitudes and orientations.
This is where Hprobe’s expertise in magnetic semiconductor testing fits into the broader semiconductor manufacturing ecosystem.
By combining precise magnetic field control, electrical measurements and automation, Hprobe helps semiconductor manufacturers characterize magnetic devices from development through production. The objective is straightforward: provide the testing capabilities needed to accelerate development, improve process understanding and support reliable manufacturing.
The feature in Advanced Packaging Magazine highlights how this capability fits alongside other technologies within the Mycronic Group as semiconductor manufacturing moves toward increasingly complex architectures and packaging processes.
Read the complete feature, “Shaping the next decade of advanced packaging innovation,” in Advanced Packaging Magazine. Read the full article
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