NEWS & EVENTS

Meet Hprobe at EMSA 2026 in Eindhoven and discover the H3DM XLL for high-throughput magnetic sensor testing and TMR sensor characterization.

A recent Semiconductor Engineering article explores why MRAM is becoming the leading candidate to replace embedded Flash in advanced semiconductor nodes, driven by demanding automotive, industrial and AI applications.

Discover the first edition of Hprobe’s It’s Magnetic! newsletter featuring MRAM Alliance news, magnetic immunity discussions, and advances in magnetic sensor testing.

As software-defined vehicles evolve, MRAM is gaining momentum thanks to its speed, endurance, and reliability for next-generation automotive systems.

The SNIA MRAM Alliance SIG is bringing together the semiconductor ecosystem to accelerate MRAM adoption across emerging applications.

Discover the first edition of Hprobe’s It’s Magnetic! newsletter featuring MRAM Alliance news, magnetic immunity discussions, and advances in magnetic sensor testing.

NY Creates deployed Hprobe's IBEX for MRAM wafer-level testing of STT-MRAM and SOT-MRAM devices, achieving accurate 3D magnetic characterization.

The SNIA MRAM Alliance highlights the rapid growth of MRAM, a next-gen memory technology projected to reach a $171B market by 2035.

SNIA announces the MRAM Alliance SIG, bringing together industry leaders to accelerate adoption, align standards, and support MRAM across applications.

Hprobe will be at INTERMAG 2026 in Manchester, showcasing its magnetic test solutions, connecting with industry leaders, and speaking on MRAM technologies.