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News & Events

PRESS RELEASES

Hprobe Announces Breakthrough in High-Volume Testing for Automotive/Consumer Advanced 3D Magnetic Sensors

2021/Jul/6

Hprobe Receives Order from a Tier-1 Semiconductor Manufacturer for a Wafer-Level Magnetic Tester to be Used for Strategic R&D of Magnetic Materials and Devices

2021/Apr/28

Hprobe, Leader in Magnetic Field Testing Creates Subsidiary in Germany and Receives First Order from Fraunhofer IPMS

2021/Jan/26

Hprobe Announces First Automated Test Equipment Dedicated to 3D Magnetic Sensors for Automotive and Industrial Applications

2020/Oct/1

HPROBE IN THE NEWS

Breakthrough in high-volume testing for automotive/consumer advanced 3D magnetic sensors

Breakthrough in high-volume testing for automotive/consumer advanced 3D magnetic sensors

2021/Jul/21

Accuracy boost for magnetic wafer probe

2021/Jul/6

可在量產中實現良率管理的STT-MRAM磁性測試

2021/Jun/9

Magnetic Testing for STT-MRAM Enabling Yield Management in Volume Manufacturing

2021/Jun/9

INDUSTRY NEWS

[Future Semiconductor Technology] The Present of the Next-Generation Ultra-Low-Power MRAM Technology

2021/May/25

MRAM Evolves In Multiple Directions

MRAM Evolves In Multiple Directions

2021/Mar/12

Spintronic devices: a promising alternative to CMOS devices

Spintronic devices: a promising alternative to CMOS devices

2021/Jan/26

Technology Optimization for Magnetoresistive RAM (STT-MRAM)

Technology Optimization for Magnetoresistive RAM (STT-MRAM)

2021/Jan/18

EVENTS

IEDM Conference to be held December 12-16, 2020

2020/Oct/2

VIDEO

Interview de Laurent Lebrun, président de Hprobe sur B SMART

Interview de Laurent Lebrun, président de Hprobe sur B SMART

2021/Apr/8