News & Events

PRESS RELEASES

Hprobe Announces Breakthrough in High-Volume Testing for Automotive/Consumer Advanced 3D Magnetic Sensors

2021/Jul/6

Hprobe Receives Order from a Tier-1 Semiconductor Manufacturer for a Wafer-Level Magnetic Tester to be Used for Strategic R&D of Magnetic Materials and Devices

2021/Apr/28

Hprobe, Leader in Magnetic Field Testing Creates Subsidiary in Germany and Receives First Order from Fraunhofer IPMS

2021/Jan/26

Hprobe Announces First Automated Test Equipment Dedicated to 3D Magnetic Sensors for Automotive and Industrial Applications

2020/Oct/1

HPROBE IN THE NEWS

SOT-MRAM Research Overview Challenges and Current Market Trends

2021/Oct/21

Breakthrough in high-volume testing for automotive/consumer advanced 3D magnetic sensors

Breakthrough in high-volume testing for automotive/consumer advanced 3D magnetic sensors

2021/Jul/21

Accuracy boost for magnetic wafer probe

2021/Jul/6

可在量產中實現良率管理的STT-MRAM磁性測試

2021/Jun/9

INDUSTRY NEWS

MRAM technologies: from space applications to unified cache memory ?

MRAM technologies: from space applications to unified cache memory ?

2021/Oct/20

Magnetic sensors-A review and recent technologies

2021/Sep/15

Emerging Memories Look to Displace NOR, SRAM

Emerging Memories Look to Displace NOR, SRAM

2021/Sep/15

[Future Semiconductor Technology] The Present of the Next-Generation Ultra-Low-Power MRAM Technology

2021/May/25

EVENTS

IEDM Conference to be held December 12-16, 2020

2020/Oct/2

VIDEO

Interview de Laurent Lebrun, président de Hprobe sur B SMART

Interview de Laurent Lebrun, président de Hprobe sur B SMART

2021/Apr/8