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Magnetic Automated Test Equipment 

Magnetic devices need to be tested under magnetic field sweep, and time spent to test wafers increases chip costs. Varying the magnetic field at a high sweeping rate above the wafer is a challenge for industrial high-volume markets.

The key purpose of Hprobe’s products is to electrically probe wafers under a magnetic field at extremely high throughput, by achieving fast testing time per device. This is possible thanks to Hprobe’s proprietary technologies of magnetic field generators.

Hprobe’s 3D magnetic field generator and Hcoil-2T magnetic field generator are patented technologies, compatible with the requirements of electrical wafer level probing requirement in mass production. The uniquely designed generators operate with power supplies and air cooling, so no complex liquid cooling is required.

Hprobe testers are operating with 100-300mm automated wafer probers. A test head integrating the generator is positioned on the wafer probing station. The testers are compatible with automatic probing stations from:

TEL (Tokyo Electron Limited)

ACCRETECH

Electroglas

The testers are composed of:

Test head

The magnetic generator is integrated into the test head, which is mounted on the automated wafer probing station, compatible for operation with single DC or RF probes and probe cards.

Instruments rack

The tester is using high-end control and sensing instrumentation. The configuration of the tester instrumentation can be configured to fulfill user requirements.

Magnetic field calibration kit

The generator has a magnetic field calibration assembly, composing of a 3D magnetic sensor with an automated positioning system to calibrate field at the exact same position as the device under test.

Software

Software with GUI for field generation, calibration, and automated electrical probing of MRAM and magnetic sensors. The software includes fab automation and production control features.

Key features

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High amplitude in-plane and perpendicular magnetic field

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3D control of field

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Amplitude and angular sweep (rotating field)

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Embedded Calibration sensor

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Automated test programs

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Parameters extraction software for MRAM

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For 100 to 300 mm wafers

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Compatible with standard probe cards

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Full and Open Software for test sequence creation and automatic probing

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Air cooling

IBEX Platform

The IBEX platform is compatible with 200mm and 300mm automated wafer probers, and is dedicated for testing MRAM magnetic tunnel junctions, and bit cells based on Spin Transfer Torque (STT-MRAM), Spin Orbit Torque (SOT-MRAM) and Voltage Controlled (VC-MRAM) technologies. The system is capable of testing at high throughput, both under fast variable magnetic field as well as with ultra-narrow pulsed signals.

IBEX-P MRAM Parametric Test

The IBEX-P system operates with single or multi-channel configurations and is designed for Statistical Process Control (SPC) of the production yield at Wafer Acceptance Test (WAT), thanks to Process Control and Monitoring (PCM) of test structures. 

IBEX is using Hprobe’s turnkey proprietary software with GUI to manually operate in R&D, or in fully automated wafer production fabs. The software includes optimized production test programs dedicated to MRAM devices.

The system is using Hprobe’s exclusive technology of the magnetic field generator integrated into the test head, which is mounted on the wafer prober.

The tester is driven by high-end instrumentation, which has been selected to achieve extremely fast testing times for characterizing MRAM magnetic tunnel junction or bit-cell. This instrumentation includes brands such as Keysight, Tektronix and NI, and are integrated using Hprobe’s proprietary building blocks.

IBEX-F Functional Test

The IBEX-F system is dedicated for testing bit arrays and System-on-Chip (SoC) embedded MRAM memories.

The test system operates in single or multi-sites configurations and is used for characterization and testing of MRAM arrays. It is aimed for product development, validation and qualification, and transfer into production. It is also designed for operation in a mass production environment for embedded MRAM devices, at the Chip Probing (CP) sorting and binning in the Back End of Line (BEOL) process.

The tester is driven by high-end instrumentation, which has been selected to achieve extremely fast testing times for characterizing MRAM magnetic tunnel junction or bit-cell. This instrumentation includes brands such as Keysight, Tektronix and NI, and are integrated using Hprobe’s proprietary building blocks.

LINX Platform

The LINX platform is compatible with 200mm and 300mm automated wafer probers and is designed for testing magnetic sensors based on xMR (Magneto Resistive) and Hall technologies. The system is capable of testing both under static and fast variable magnetic field, controllable in any direction of space.

LINX-1 – Magnetic Sensor Tester

The LINX-1 tester is dedicated to magnetic sensor chip sorting at wafer level.

It is using Hprobes’s turnkey proprietary software with GUI for field pattern generation and calibration in single or multi-channel configurations and includes optimized field generation patterns available in static or dynamic modes. The system has programmable features to enable integration with the user’s test platform.

LINX-1 is using Hprobe’s proprietary technology of the magnetic field generator, integrated with a 3-axis robotized test head. It can operate with manually or automatically loaded probe cards.

The field generation is driven by high performance instrumentation to achieve stable static or high sweep rate variable fields.

This instrumentation includes brands such as Keysight, Tektronix and NI, and are integrated using Hprobe’s proprietary building blocks.