Discover the first edition of Hprobe’s It’s Magnetic! newsletter featuring MRAM Alliance news, magnetic immunity discussions, and advances in magnetic sensor testing.
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MRAM Wafer-Level Testing: Hprobe IBEX at NY Creates
NY Creates deployed Hprobe’s IBEX for MRAM wafer-level testing of STT-MRAM and SOT-MRAM devices, achieving accurate 3D magnetic characterization.
MRAM Alliance targets $171B next-gen memory market
The SNIA MRAM Alliance highlights the rapid growth of MRAM, a next-gen memory technology projected to reach a $171B market by 2035.
SNIA launches MRAM Alliance to drive adoption
SNIA announces the MRAM Alliance SIG, bringing together industry leaders to accelerate adoption, align standards, and support MRAM across applications.
Hprobe at INTERMAG 2026 in Manchester
Hprobe will be at INTERMAG 2026 in Manchester, showcasing its magnetic test solutions, connecting with industry leaders, and speaking on MRAM technologies.
Hprobe gains traction in China’s semiconductor market
After SEMICON China, Hprobe gains strong media visibility, highlighting growing demand for MRAM and magnetic test solutions.
We’re heading to SEMICON China
25-27/03/2026 We’re heading to SEMICON China 2026 in Shanghai. Part of Mycronic, Hprobe will be present alongside Quantum Design China supporting the growing momentum of MRAM…
Chip Scale Review: TMR testing at wafer scale
Siamak Salimy explains TMR’s growth and how 3D wafer-level testing ensures precision and high throughput for modern chips.
We will be exhibiting at SEMICON Korea
11-13/02/2026 We will be exhibiting at SEMICON Korea: This will be a good opportunity to meet and exchange with partners, customers, and industry …