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Hprobe claims first turnkey test equipment dedicated to 3D Magnetic sensors

Oct 2, 2020 | Hprobe in the news

Electronics Weekly | David Manners | 2nd October 2020

Hprobe, a provider of  ATE for magnetic devices, today announced turnkey testing equipment dedicated to 3D magnetic sensors used in both automotive and industrial applications.

The equipment is based on Hprobe’s 3D magnetic field generator technology for single and multi-site testing at wafer-level, under magnetic field.

Operating with automated wafer probing stations and external electrical testers, it offers significant throughput performances, with high flexibility, and compatibility with end-user existing platforms.

“Our new equipment addresses the crucial step of chip sorting for the new generation of magnetic sensors tested at wafer-level, under high field intensity, and on a large area coverage. It offers fully controllable 3D static and variable magnetic field capability allowing the use of a single platform to test different types of products,” says Siamak Salimy, founder and CTO of Hprobe, “this is key for our customers and a major milestone for the industry as evidenced by orders already received from a number of major sensor manufacturers.”