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MRAM testing for high-volume manufacturing

Aug 23, 2019 | Hprobe in the news

Chip Scale Review | Siamak Salimy (CTO Hprobe) | July-August, 2019

Data centers (i.e., AI, machine learning, deep learning, computation run-off data center hardware) are driving next generation semiconductor packaging, especially 2.5D and 3D integrations. In particular, data centers are the primary target market for 3D DRAM, 3D NAND for SSDs, and 2.5D CPU/GPU/FPGA/SoCs, etc. These devices are the focus of all the large semiconductor companies for not only their current high-end product lines, but also those of the future.