Semiconductor Digest | Siamak Salimy (Founder and CTO of Hprobe) | July, 2019
Nearly every new technology breakthrough in the semiconductor industry targets high volume manufacturing and comes with its unique specificities. This results in challenges for engineers to manufacture and test new integrated circuits (ICs) on the wafer. To support the development of a product reaching the end user, the wafers have to be tested by addressing the uniqueness of the technology. We have seen over the past decades many wafer test challenges resolved for a number of technologies in the semiconductor industry, such as DRAM (Dynamic Random Access Memory) technology, present in all of our personal computers (PCs).