NEWS & EVENTS

MRAM enters a new era. Discover highlights from the 2026 SNIA Storage Developers Conference and Hprobe’s role in supporting magnetic memory testing.

Advanced Packaging Magazine features Hprobe, highlighting how magnetic semiconductor testing helps ensure known-good MRAM and magnetic sensor devices enter packaging flows.

Meet Hprobe at SEMICON West 2026 in San Francisco, where our team will showcase advanced magnetic testing solutions for MRAM and magnetic sensors, from R&D to wafer-level production testing.

STT-MRAM magnetic immunity is critical for MRAM devices exposed to external magnetic fields. Learn how magnetic robustness is characterized through controlled field, electrical and temperature testing.

Meet Hprobe at EMSA 2026 in Eindhoven and discover the H3DM XLL for high-throughput magnetic sensor testing and TMR sensor characterization.

A recent Semiconductor Engineering article explores why MRAM is becoming the leading candidate to replace embedded Flash in advanced semiconductor nodes, driven by demanding automotive, industrial and AI applications.

Discover the first edition of Hprobe’s It’s Magnetic! newsletter featuring MRAM Alliance news, magnetic immunity discussions, and advances in magnetic sensor testing.

As software-defined vehicles evolve, MRAM is gaining momentum thanks to its speed, endurance, and reliability for next-generation automotive systems.

The SNIA MRAM Alliance SIG is bringing together the semiconductor ecosystem to accelerate MRAM adoption across emerging applications.

Discover the first edition of Hprobe’s It’s Magnetic! newsletter featuring MRAM Alliance news, magnetic immunity discussions, and advances in magnetic sensor testing.